Chris_Lonardo
[H]ard|OCP Storage Engineer & Editor
- Joined
- Feb 10, 2002
- Messages
- 1,726
I have a 1U Supermicro system with two Xeon L5639s that I would like to move into a tower case. Obviously, the 1U heatsinks are designed for forced airflow (a bunch of annoying little 40mm fans blowing through the chassis)
The L5639 runs pretty cool, as it's only a 60W chip. I don't want to shell out for new heatsinks if I don't have to- the Xeon LGA1366 mounts HSFs differently than the i7 flavor, and requires a different HSF in many cases.
If I just use the 1U heatsinks with a 120mm fan rigged to blow across them, do you think that will be reasonable, or should I rig up some sort of baffle to force cool air through?
The L5639 runs pretty cool, as it's only a 60W chip. I don't want to shell out for new heatsinks if I don't have to- the Xeon LGA1366 mounts HSFs differently than the i7 flavor, and requires a different HSF in many cases.
If I just use the 1U heatsinks with a 120mm fan rigged to blow across them, do you think that will be reasonable, or should I rig up some sort of baffle to force cool air through?